Electronic component metal material and method for manufacturing the same
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United States of America Patent
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May 22, 2018
Issued Date -
N/A
app pub date -
Oct 31, 2012
filing date -
Oct 4, 2012
priority date (Note) -
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Abstract
There are provided an electronic component metal material having low insertability/extractability, low whisker formability and high durability, and a method for manufacturing the electronic component metal material. The electronic component metal material 10 includes a base material 11, an A layer 14 constituting an outermost surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the outermost surface layer (A layer) 14 has a thickness larger than 0.2 μm, and the middle layer (B layer) 13 has a thickness of 0.001 μm or larger.
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