Wiring substrate and manufacturing method thereof

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United States of America Patent

PATENT NO 9980364
SERIAL NO

15077211

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is wiring substrate, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
YAZAKI CORPORATION8-15 KONAN 1-CHOME MINATO-KU TOKYO 1080075 ?1080075

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harao, Akira Makinohara, JP 7 12
Kubota, Minoru Makinohara, JP 149 1841
Matsunaga, Mototatsu Makinohara, JP 13 74
Sugiura, Yasuhiro Makinohara, JP 4 0

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