High speed signal routing topology for better signal quality
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United States of America Patent
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May 22, 2018
Issued Date -
N/A
app pub date -
Jan 12, 2015
filing date -
Jan 12, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
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