Printed wiring board
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United States of America Patent
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-
May 22, 2018
Issued Date -
N/A
app pub date -
Feb 16, 2016
filing date -
Feb 16, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed wiring board includes a resin insulating layer having recess portions formed on first surface, a first conductor layer formed in the recess portions and including pads positioned to mount an electronic component, conductive pillars formed on the pads, respectively, and formed to mount the electronic component onto the resin insulating layer, a second conductor layer formed on second surface of the resin insulating layer on the opposite side with respect to the first surface, and a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer and connecting the first and second conductor layers. The pillars is formed such that each of the pads has an exposed surface exposed from a respective one of the conductive pillars, and the pads are formed such that the exposed surface is recessed from the first surface of the resin insulating layer.
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Family
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Cited Art Landscape
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