Printed circuit board consisting of at least two printed circuit board regions
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United States of America Patent
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-
May 22, 2018
Issued Date -
N/A
app pub date -
Oct 24, 2016
filing date -
Jul 10, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.
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