Method of manufacturing an on-board wireless module architecture
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United States of America Patent
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May 22, 2018
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app pub date -
Mar 30, 2015
filing date -
Jun 22, 2010
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Abstract
Embodiments of the present disclosure provide a method that includes forming a wireless module on a first region of a circuit board and forming a host controller module on a second region of the circuit board. The method also includes forming, on the circuit board, a perforation along a boundary that separates the first region from the second region. The method further includes forming a plurality of first trace structures in the first region and forming a plurality of second trace structures in the second region, wherein each second trace structure of the plurality of second trace structures is electrically coupled to a corresponding first trace structure of the plurality of first trace structures. The method also includes disposing a tri-state contact in the second region.
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