Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device
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United States of America Patent
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May 22, 2018
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N/A
app pub date -
Sep 12, 2016
filing date -
Mar 14, 2014
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Abstract
A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.
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