Bonding electronic components to patterned nanowire transparent conductors

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United States of America Patent

PATENT NO 9980394
SERIAL NO

14897521

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Abstract

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A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.

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Patent Owner(s)

  • 3M INNOVATIVE PROPERTIES COMPANY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dodds, Shawn C St. Paul, US 34 60
Gilman, Ann M Woodbury, US 29 36
Pekurovsky, Mikhail L Bloomington, US 120 609
Stay, Matthew S Minneapolis, US 70 409
Theis, Daniel J Mahtomedi, US 33 80

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