Copper foil composite, formed product and method of producing the same
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United States of America Patent
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May 29, 2018
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Jan 13, 2012
filing date -
Jan 13, 2012
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Abstract
A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f1/(F×T) wherein f1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Sn layer having a thickness of 0.2 to 3.0 μm is formed on a surface of the copper foil on which the resin layer is not laminated.
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