Polyimide-containing layer and method for etching polyimide-containing layer

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United States of America Patent

PATENT NO 9982108
SERIAL NO

13900324

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Abstract

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The disclosure provides a polyimide-containing layer suitable for being etched by an alkaline solution and a method for etching a polyimide-containing layer. The polyimide-containing layer suitable for being etched by an alkaline solution includes 20-50 parts by weight of a silica dioxide, and 50-80 parts by weight of a polyimide.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTECHUTUNG HSINCHU 310401

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leu, Chyi-Ming Hsinchu County, TW 69 302
Lin, Chih-Cheng Hsinchu, TW 79 292

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