Curable resin composition, and composition for hard coat

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United States of America Patent

PATENT NO 9982162
SERIAL NO

15024219

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Abstract

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The present invention provides a curable resin composition excellent in dispersion stability and capable of bettering various physical properties of hard coating films to be formed through curing, without requiring surface treatment of inorganic microparticles of silica or the like and use of dispersant. The curable resin composition contains an alkylene oxide-modified dipentaerythritol (meth)acylate and, as dispersed therein, surface-untreated inorganic microparticles having a mean particle size of from 1 to 150 nm. A ratio of inorganic microparticles in a total weight of these is from 10 to 45% by weight and a content of solvent is 1% by weight or less.

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Patent Owner(s)

Patent OwnerAddress
DAI-ICHI KOGYOSEIYAKU CO LTD55 NISHISHICHIJO HIGASHIKUBO-CHO SHIMOGYO-KU KYOTO-SHI KYOTO 600-8873

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takamura, Naohiro Kyoto, JP 3 5

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