Manufacturing method of cylindrical sputtering target material

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United States of America Patent

PATENT NO 9982335
SERIAL NO

14911236

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Abstract

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A manufacturing method of a cylindrical sputtering target material formed of copper or a copper alloy is provided, the method including: a continuous casting step of casting a cylindrical ingot having an average crystal grain diameter equal to or smaller than 20 mm using a continuous casting machine or a semi-continuous casting machine; and a cold working step and a heat treatment step of repeatedly performing cold working and a heat treatment with respect to the cylindrical ingot, to form the cylindrical sputtering target material in which an average crystal grain diameter of an outer peripheral surface is from 10 μm to 150 μm and a proportion of the area of crystal grains having a crystal grain diameter more than double the average crystal grain diameter is less than 25% of the entire crystal area.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATIONCHIYODA-KU TOKYO 100-8117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kumagai, Satoshi Osaka, JP 22 230
Ohto, Michiaki Osaka, JP 5 0
Sakurai, Akira Osaka, JP 74 975
Sonohata, Takashi Iwaki, JP 2 0

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