Importance

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Abstract

A detector assembly is provided that includes a semiconductor detector, a collimator and a processing unit. The semiconductor detector has a first surface and a second surface opposed to each other. The first surface includes pixels (which in turn comprise corresponding pixelated anodes), and the second surface includes a cathode electrode. The collimator includes openings, with each opening associated with a single corresponding pixel of the semiconductor detector. The processing unit is configured to identify detected events within virtual sub-pixels distributed along a length and width of the semiconductor detector. Each pixel includes (e.g., has associated therewith) a plurality of corresponding virtual sub-pixels, with absorbed photons are counted as events in a corresponding virtual sub-pixel. Absorbed photons are counted as events within a thickness of the semiconductor detector at a distance corresponding to an energy window width used to identify the events as photon impacts.

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First Claim