Apparatus and method for treating substrate

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United States of America Patent

PATENT NO 9984902
SERIAL NO

13559851

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Abstract

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Provided are an apparatus and method for treating a substrate. Specifically, provided are an apparatus and method for treating a substrate through a supercritical process. The apparatus includes: a housing providing a space for performing a process; a support member disposed in the housing to support a substrate; a supply port configured to supply a process fluid to the housing; a shield member disposed between the supply port and the support member to prevent the process fluid from being directly injected to the substrate; and an exhaust port configured to discharge the process fluid from the housing.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTDCHEONAN-SI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Sungho Cheonan-si, KR 49 107
Kim, Boong Cheonan-si, KR 18 126
Kwon, Oh Jin Cheonan-si, KR 31 138
Park, Joo Jib Asan-si, KR 18 98

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