Electrostatic chuck design for high temperature RF applications
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Dec 8, 2015
filing date -
Dec 11, 2014
priority date (Note) -
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Abstract
An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
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