Pre-mold for a microphone assembly and method of producing the same

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United States of America Patent

PATENT NO 9986354
SERIAL NO

13927865

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Abstract

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A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dangelmaier, Jochen Beratzhausen, DE 57 513
Kohl, Dominik Wenzenbach, DE 6 20
Mueller, Thomas Lapperdorf, DE 218 2691
Schindler, Stefan Uwe Reichenbach, DE 2 20
Theuss, Horst Wenzenbach, DE 233 3067

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