Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same
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United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Jul 15, 2016
filing date -
Feb 12, 2015
priority date (Note) -
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Abstract
An enhanced substrate for use in printed circuit boards (PCBs) includes low-Dk-core glass fibers having low dielectric constant (Dk) cores. In some embodiments, the low-Dk-core glass fibers are filled with a low Dk fluid, such as a gas (e.g., air, nitrogen and/or a noble gas) or a liquid. After via holes are drilled or otherwise formed in the substrate, silane is applied to the ends of hollow glass fibers exposed in the via holes to seal the low Dk fluid within the cores of the hollow glass fibers. In some embodiments, the low-Dk-core glass fibers are filled with a solid (e.g., a low Dk resin). For example, a hollow glass fiber may be provided, and then filled with a low Dk resin in a liquid state. The low Dk resin within the hollow glass fiber is then cured to a solid state.
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