Coil component and method of manufacturing the same

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United States of America Patent

PATENT NO 9986640
SERIAL NO

14927237

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Abstract

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A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU GYEONGGI-DO SUWON-SI 16674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jong Yun Suwon-Si, KR 32 289
Sim, Won Chul Suwon-Si, KR 75 364
Yang, Jin Hyuck Suwon-Si, KR 33 174
Yang, Ju Hwan Suwon-Si, KR 101 308

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