Packaged electronic devices with top terminations, and methods of manufacture thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 29, 2018
Issued Date -
N/A
app pub date -
Nov 21, 2014
filing date -
Nov 21, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.
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