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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD	8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

• B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
• B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chan, Chin-Hsiang	New Taipei, TW	15	230
Chen, Liang-Guang	Hsinchu, TW	82	310
Lu, Yung-Cheng	Hsinchu, TW	179	2493
Suen, Shich-Chang	Hsinchu, TW	40	220

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 5, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 5, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 05, 2018	US,9987720,B2   US9987720B2	GRANTED PATENT AS SECOND PUBLICATION
May 19, 2016	US,20160136777,A1   US20160136777A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9987720

Method for operating a polishing head and method for polishing a substrate

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