Mold

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United States of America Patent

PATENT NO 9987769
APP PUB NO 20160031121A1
SERIAL NO

14797868

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Abstract

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A mold capable of inhibiting supercooling is provided. The mold includes a cooling channel formed therein and has a recess formed in a cavity surface, and a heat-insulating barrier formed between the cooling channel and a bottom surface of the recess formed in the cavity surface. The heat-insulating barrier includes a space formed between the cooling channel and the bottom surface of the recess formed in the cavity surface. The space is filled with a medium (for example, air) having a thermal conductivity lower than that of other portions of the mold.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHA1 TOYOTA-CHO TOYOTA-SHI AICHI-KEN 471-8571

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sugiura, Naoaki Takahama, JP 19 7

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