Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation

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United States of America Patent

PATENT NO 9988265
SERIAL NO

15243031

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Abstract

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Trapped sacrificial structures and thin-film encapsulation methods that may be implemented to manufacture trapped sacrificial structures such as relative humidity sensor structures, and spacer structures that protect adjacent semiconductor structures extending above a semiconductor die substrate from being contacted by a molding tool or other semiconductor processing tool in an area of a die substrate adjacent the spacer structures.

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Patent Owner(s)

  • SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hui, Jeremy R San Jose, US 6 26
Nervegna, Louis Andover, US 9 81
Quevy, Emmanuel P El Cerrito, US 52 1074

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