Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate

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United States of America Patent

PATENT NO 9988573
APP PUB NO 20120329370A1
SERIAL NO

13582969

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Abstract

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The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b).

    (a) Producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.(b) Producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 105-7325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwano, Tomohiro Hitachi, JP 56 332
Narita, Takenori Hitachi, JP 14 132
Ryuzaki, Daisuke Kokubunji, JP 53 347

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