Apparatus and method of treating surface of semiconductor substrate

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United States of America Patent

PATENT NO 9991111
SERIAL NO

15827427

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit, first to fourth supplying units, and a removing unit. A substrate holding and rotating unit holds a semiconductor substrate, having a convex pattern formed on its surface, and rotates the semiconductor substrate. A first supplying unit supplies a chemical onto the surface of the semiconductor substrate in order to clean the semiconductor substrate. A second supplying unit supplies pure water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A third supplying unit supplies a water repellent agent to the surface of the semiconductor substrate in order to form a water repellent protective film onto the surface of the convex pattern. A fourth supplying unit supplies alcohol, which is diluted with pure water, or acid water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A removing unit removes the water repellent protective film with the convex pattern being left.

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Patent Owner(s)

  • TOSHIBA MEMORY CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Shinsuke Yokkaichi, JP 25 137
Koide, Tatsuhiko Yokkaichi, JP 41 291
Ogawa, Yoshihiro Yokkaichi, JP 207 2295
Okuchi, Hisashi Yokohama, JP 62 526
Tomita, Hiroshi Yokohama, JP 314 3959

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