Plating apparatus and plating method

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United States of America Patent

PATENT NO 9991145
SERIAL NO

15630119

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATIONOTA-KU TOKYO 144-8510

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Minami, Yoshio Tokyo, JP 21 145

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