Procedure of processing a workpiece and an apparatus designed for the procedure
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United States of America Patent
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Jun 5, 2018
Issued Date -
N/A
app pub date -
Sep 28, 2016
filing date -
Dec 12, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others.
First Claim
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
- C25D:PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B05D:PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MAT....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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