Encapsulation material for light emitting diodes

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United States of America Patent

PATENT NO 9991182
APP PUB NO 20160172552A1
SERIAL NO

14905404

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Abstract

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The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance.

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Patent Owner(s)

  • AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Grottenmüller, Ralph Wiesbaden, DE 1 2
Karunanandan, Rosalin Frankfurt am Main, DE 3 8
Kita, Fumio Wiesbaden, DE 18 131
Lenz, Helmut Eschborn, DE 66 682
Wagner, Dieter Wiesbaden, DE 28 349

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