Composition for forming conductive pattern, method for forming conductive pattern using the same, and resin components having conductive pattern thereon
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 5, 2018
Issued Date -
N/A
app pub date -
Apr 16, 2015
filing date -
Apr 16, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern reducing degradation of mechanical physical properties and having excellent adhesion strength, on a polymeric resin product or resin layer, a method for forming a conductive pattern using the same, and a resin component having the conductive pattern. The composition for forming a conductive pattern includes: a polycarbonate-based resin; and particles of a non-conductive metal compound including a first metal and a second metal and having a spinel structure, wherein the particles have a particle diameter of 0.1 to 6 μm; wherein a metal nuclei including the first metal, the second metal, or an ion thereof is formed from the particles of the non-conductive metal compound by electromagnetic wave irradiation. The non-conductive metal compound may have an average specific surface area of about 0.5 to 10 m2/g, preferably about 0.5 to 8 m2/g, more preferably about 0.7 to about 3 m2/g.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully