Wired circuit board having one of the conductive layers disposed in an opening formed in metal supporting board
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United States of America Patent
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Jun 5, 2018
Issued Date -
Feb 9, 2017
app pub date -
Mar 20, 2015
filing date -
Apr 21, 2014
priority date (Note) -
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Abstract
A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.
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