Metal foil with carrier

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United States of America Patent

PATENT NO 9992874
SERIAL NO

13132766

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a metal foil with a carrier as a laminated body in which a carrier A and a metal foil B are placed alternately, wherein the carrier A and the metal foil B respectively have a glossy surface, so-called ‘S surface’, and the said surfaces are laminated to face each other. The present invention relates to a copper foil with a carrier which is used for producing a single-sided laminated plate or a multilayer laminated plate of two or more layers for use in a printed wiring board. In particular, this copper foil with a carrier is used for producing a laminated plate, and its objective is to improve the handling performance during the production process of a printed board and reduce costs by increasing the yield.

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Patent Owner(s)

Patent OwnerAddress
JX NIPPON MINING & METALS CORPORATIONTOKYO 100-8164

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takamori, Masayuki Tokyo, JP 7 12

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