Circuit board and method of manufacturing the same
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United States of America Patent
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Jun 5, 2018
Issued Date -
Jun 30, 2016
app pub date -
Nov 2, 2015
filing date -
Dec 26, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A circuit board disclosed herein includes: two substrates opposed to each other, where a dielectric being interposed between the two substrates; a through hole formed in each of the two substrates and filled with the dielectric; a first conductor film formed on an inner surface of the through hole; and a second conductor film covering the through hole on a main surface of each of the two substrates on an opposite side to the dielectric, the second conductor film being connected to the first conductor film on the main surface side.
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