Methods of fabricating electronic and mechanical structures

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United States of America Patent

PATENT NO 9993982
SERIAL NO

14232396

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Abstract

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The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.

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Patent Owner(s)

  • NUVOTRONICS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cardwell, Dara L Pulaski, US 2 62
Sherrer, David W Radford, US 107 4412

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