Thermally expandable resin composition

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9994693
SERIAL NO

14434796

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • SEKISUI CHEMICAL CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Otsuka, Kenji Hasuda, JP 73 1556
Tono, Masaki Tokyo, JP 9 68
Yano, Hideaki Hasuda, JP 42 399
Yoshitake, Toshitaka Hasuda, JP 6 26

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Dec 12, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 12, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00