Epoxy resin composition, prepreg, fiber-reinforced composite material, and method for producing same

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United States of America Patent

PATENT NO 9994697
SERIAL NO

14351387

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Abstract

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The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.) (In formula (2), R3 represents an organic group having 1 or more carbon atoms, and R4 to R6 represent hydrogen atoms, methyl groups or ethyl groups.)

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuhara, Yasuhiro Toyohashi, JP 11 154
Kaneko, Manabu Toyohashi, JP 34 177
Ushiyama, Hisaya Toyohashi, JP 8 28

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