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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
KCTECH CO LTD	30 JE2GONGDAN 3-GIL MIYANG-MYEON ANSEONG-SI GYEONGGI-DO

International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
• C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hwang, Jin Sook	Anseong-si, KR	5	2
Kong, Hyun Goo	Anseong-si, KR	10	15
Park, Han Teo	Anseong-si, KR	19	3

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 12, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 12, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 12, 2018	US,9994735,B2   US9994735B2	GRANTED PATENT AS SECOND PUBLICATION
January 12, 2017	US,20170009353,A1   US20170009353A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9994735

Slurry composition for polishing tungsten

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