Slurry compounds and methods of fabricating semiconductor devices using the same

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United States of America Patent

PATENT NO 9994737
SERIAL NO

15389800

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Abstract

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Provided are slurry compounds for polishing an SOH organic layer and methods of fabricating a semiconductor device using the same. The slurry compound may include a polishing particle, an oxidizing agent including at least one selected from the group consisting of a nitrate, a sulfate, a chlorate, a perchlorate, a chlorine, and a peroxide, and a polishing accelerator.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Sangkyun Hwaseong-si, KR 34 602
Kim, Yun-Jeong Suwon-si, KR 28 122
Park, SeungHo Suwon-si, KR 60 157

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