Polishing liquid and method of polishing SiC substrate

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United States of America Patent

PATENT NO 9994739
SERIAL NO

14927752

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Abstract

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Provided is a polishing liquid which contains a permanganate, a pH adjustor, and water and which is used for polishing of a SiC substrate. Also provided is a method of polishing a SiC substrate, the method including: a first polishing step of polishing the SiC substrate by use of a first polishing liquid containing a permanganate, inorganic salts having an oxidizing ability, and water; and a second polishing step of performing finishing polishing of the SiC substrate by use of a second polishing liquid containing a permanganate, a pH adjustor, and water after the first polishing step.

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Patent Owner(s)

  • DISCO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kojima, Katsuyoshi Tokyo, JP 10 19
Sato, Takeshi Tokyo, JP 424 4532

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