Enhanced adhesive materials and processes for 3D applications
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United States of America Patent
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Jun 12, 2018
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app pub date -
Dec 13, 2015
filing date -
Dec 13, 2015
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Abstract
The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
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