Semiconductor device with optical and electrical vias

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United States of America Patent

PATENT NO 9995894
APP PUB NO 20160259139A1
SERIAL NO

15028934

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Abstract

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The method comprises providing a semiconductor substrate, which has a main surface and an opposite further main surface, arranging a contact pad above the further main surface, forming a through-substrate via from the main surface to the further main surface at a distance from the contact pad and, by the same method step together with the through-substrate via, forming a further through-substrate via above the contact pad, arranging a hollow metal via layer in the through-substrate via and, by the same method step together with the metal via layer, arranging a further metal via layer in the further through-substrate via, the further metal via layer contacting the contact pad, and removing a bottom portion of the metal via layer to form an optical via laterally surrounded by the metal via layer.

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Patent Owner(s)

Patent OwnerAddress
AMS AGSCHLOSS PREMSTAETTEN TOBELBADER STR 30 PREMSTAETTEN 8141

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kraft, Jochen Oberaich, AT 37 114
Rohracher, Karl Graz, AT 4 6
Teva, Jordi Veldhoven, NL 13 36

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