Multilayer ceramic electronic component and method of manufacturing the same
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United States of America Patent
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Jun 12, 2018
Issued Date -
Aug 11, 2016
app pub date -
Nov 16, 2015
filing date -
Feb 6, 2015
priority date (Note) -
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Abstract
A multilayer ceramic electronic component includes a ceramic body having a stacked plurality of dielectric layers and first and second end portions and a plurality of lateral surfaces. A plurality of internal electrodes stacked in the ceramic body face each other with respective dielectric layers interposed therebetween and exposed to first and second lateral surfaces of the ceramic body opposing each other through respective lead portions thereof. At least two first external electrodes and at least two second external electrodes are provided on the first and second lateral surfaces to be connected to the respective lead portions, respectively. An insulation layer is provided on the first and second lateral surfaces of the ceramic body except for the first and second external electrodes.
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