Conductive material formulation and use thereof

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United States of America Patent

PATENT NO 9997298
SERIAL NO

14278311

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Abstract

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The invention pertains to a conductive material formulation comprising:

    (a) a conductive polymer material; and(b) an insulation material,wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; andwherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.

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Patent Owner(s)

Patent OwnerAddress
ETERNAL MATERIALS CO LTDTAIWAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Shinn-Horng Kaohsiung, TW 15 25

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