Sputtering apparatus and substrate processing apparatus
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United States of America Patent
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Jun 12, 2018
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N/A
app pub date -
May 28, 2015
filing date -
Nov 30, 2012
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Abstract
A sputtering apparatus includes a shutter unit, a plurality of target holders, and a substrate holder which can rotate about an axis perpendicular to a surface on which a substrate is held. The shutter unit includes a first shutter having first and second apertures and a second shutter having third and fourth apertures. The plurality of target holders are arranged on a first virtual circle centered on the axis, with the arrangement intervals between the plurality of target holders on the first virtual circle including at least two types of arrangement intervals.
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