Via structures for thermal dissipation

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United States of America Patent

PATENT NO 9997428
APP PUB NO 20170018478A1
SERIAL NO

14799534

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Abstract

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An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITEDSINGAPUR 768923

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alawani, Ashish San Jose, US 12 118
Haney, Sarah San Jose, US 17 130
Maple, Marshall Cupertino, US 9 89
Sun, Li Fremont, US 351 3994

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