Leads frames with crossing leads
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Jun 23, 2017
filing date -
Apr 24, 2015
priority date (Note) -
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Abstract
An electronic component, in one embodiment, includes a semiconductor die, a die pad supporting the semiconductor die, and a plurality of leads that include a first set of metal lines and a second set of metal lines. The first set of metal lines cross over the second set of metal lines at crossings. The first set of metal lines is separated by a molding compound from the second set of metal line at the crossings. The first set of metal lines is in a same first plane parallel to the semiconductor die. Each of the second set of metal lines include a first portion oriented along the first set of metal lines and disposed in the first plane, and a second portion offset from the first portion. A plurality of electrical connections couple the semiconductor die to the plurality of leads.
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