Circuits and antennas integrated in dies and corresponding method

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United States of America Patent

PATENT NO 9997478
SERIAL NO

15481910

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Abstract

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Circuits and antennas integrated in dies and corresponding method. The circuits and the antennas are positioned on the front surface and the back surface of the substrate respectively, but both are electrically coupled to the shared ground of the substrate. To maintain the mechanical strength of the die, some dummy metals are positioned on the back surface of the substrate and positioned around but separated away the antennas. Further, to reduce the potential side effects induced by the induced current, some ground balls are positioned on one or surfaces of the substrate.

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Patent Owner(s)

Patent OwnerAddress
TZUANG CHING KUANG CNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tzuang, Ching-Kuang C Hsinchu County, TW 6 66

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