Method of determining curing conditions, method of producing circuit device, and circuit device

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United States of America Patent

PATENT NO 9997491
APP PUB NO 20160148899A1
SERIAL NO

14406958

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Abstract

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A method of determining curing conditions is for determining the curing conditions of a thermosetting resin to seal a conductive part between a substrate and an electronic component. A curing degree curve is created. The curing degree curve indicates, with respect to each of heating temperatures, relationship between heating time and curing degree of the thermosetting resin. On the basis of the created curing degree curve, a void removal time of a void naturally moving upward in the thermosetting resin, at a first heating temperature, is calculated. The first heating temperature is one of the heating temperatures.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 108-0075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichimura, Takeshi Kanagawa, JP 31 244

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