Electronic device module and method of manufacturing the same

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United States of America Patent

PATENT NO 9997504
SERIAL NO

15075824

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Abstract

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In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Jin Su Suwon-si, KR 139 951
Kim, Sung Ho Suwon-si, KR 253 1085
Lim, Jae Hyun Suwon-si, KR 286 4214
Ryu, Jong In Suwon-si, KR 27 137

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