Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 9997543
SERIAL NO

15153127

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Abstract

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There has been a case where peeling occurs if an internal stress of a wiring of a TFT is strong. In particular, the internal stress of a gate electrode largely influences a stress that a semiconductor film receives, and there has been a case where the internal stress becomes a cause of reduction in electric characteristics of a TFT depending on the internal stress. According to the present invention, an impurity element is introduced into a wiring, or both the introduction of an impurity element and heat treatment are performed, whereby the wiring can be controlled to have a desired internal stress. It is effective that the present invention is particularly applied to a gate electrode. Further, it is possible that the introduction of an impurity element and the heat treatment are conducted to only a desired region to conduct control to attain a desired internal stress.

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Patent Owner(s)

  • SEMICONDUCTOR ENERGY LABORATORY CO., LTD

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arao, Tatsuya Atsugi, JP 131 3032

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