MEMS microphone element
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United States of America Patent
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Jun 12, 2018
Issued Date -
Apr 21, 2016
app pub date -
Oct 16, 2015
filing date -
Oct 16, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A concept is provided which permits the implementation of MEMS microphone elements having a very good SNR, high microphone sensitivity and a large frequency bandwidth. The microphone structure of the MEMS element is implemented in a layer structure and includes at least one sound pressure-sensitive diaphragm (210), an acoustically permeable counter element (220) and a capacitor system for detecting the diaphragm deflections, the diaphragm (210) and the counter element (220) being situated on top of each other and a distance apart from one another in the layer structure and each bring equipped with at least one electrode of the capacitor system. According to the invention, the layer structure of the diaphragm (210) includes at least one thin closed layer (1) and at least one thick structured layer (2), a grid structure (100) covering the entire diaphragm area being provided in the thick layer (2), which determines the stiffness of the diaphragm (210).
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