Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate
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United States of America Patent
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Jun 12, 2018
Issued Date -
Jun 22, 2017
app pub date -
Sep 7, 2016
filing date -
Dec 21, 2015
priority date (Note) -
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Abstract
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
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